Custom Bare Boards for LED Lighting Applications
LED PCB Manufacturing
Custom bare LED PCBs in aluminum, copper-base, FR-4 and flexible constructions. PCBELEC reviews your fabrication files, material and insulation requirements for prototype and production orders.
Send your board files and manufacturing requirements to sales@pcbelec.com
- Board Construction Metal-Base, FR-4 & Flex
- Manufacturing Definition Thermal Stackup & Insulation
- Order Stages Prototypes to Production
Choose the Board Construction, Then Define the Details
LED PCB Construction Options
LED PCBs can use different substrate and circuit constructions. Select the board around the electrical layout, thermal path, insulation and mechanical requirements rather than one conductivity number alone.
- Circuit Copper Insulating Dielectric Aluminum Base
Simplified insulated-base example · not to scale Aluminum LED PCBs
An aluminum PCB combines circuit copper, an insulating dielectric and a metal base in the specified construction. Define the dielectric and mounting requirements together with the circuit layout.
- Circuit Copper Insulating Dielectric Copper Base
Insulated example · direct thermal regions require separate definition Copper-Base LED PCBs
A copper-core PCB uses a specified copper-base construction. Identify whether the design is insulated or includes defined local direct thermal connections; do not infer the connection from the base material alone.
- Circuit Copper Flexible Dielectric
Simplified flex example · openings and bonding layers omitted Flexible LED PCBs
A flexible PCB can support strip and conforming board formats. Specify the dielectric, protective layers, bend regions and local reinforcement for the intended installation.
Match the Substrate to the Manufacturing Requirements
Swipe horizontally to view the complete comparison.
| Construction | Selection Focus | Key Information to Supply |
|---|---|---|
| Aluminum IMS | Circuit, insulating dielectric, metal base and the intended mounting thermal path. | Dielectric requirements, base and finished thickness, insulation criteria and board outline. |
| Copper-base | Base structure and the defined relationship between thermal pads, insulation and metal regions. | Construction section, thermal connection areas, electrical isolation and mechanical dimensions. |
| FR-4 | Routing, copper distribution, layer construction and the designed thermal path. | Material, copper, hole structures and multilayer PCB stackup where applicable. |
| Flexible circuit | Installation shape, bend requirements, circuit copper and protective construction. | Material system, bend zones, Coverlay, stiffeners and local thickness requirements. |
| Ceramic / specified structures | Exact substrate and metallization construction, not a generic material ranking. | Material designation, construction drawing and application-specific acceptance requirements for review. |
Construction-Specific Bare-Board Fabrication
LED PCB Manufacturing Capabilities
PCBELEC manufactures LED bare boards from the specified construction and production files. Review layer options separately from the feature rules and material requirements of the actual build.
Construction and Layer Options
Swipe horizontally to view the complete construction table.
| LED PCB Construction | Listed Layer Range | Define in the Construction Package |
|---|---|---|
| Aluminum-based | 1–4 circuit layers. | Circuit construction, insulating dielectric, aluminum base and metal-related hole or isolation requirements. |
| Copper-based | 1–8 circuit layers. | Copper-base structure, insulated regions and any specified local direct thermal connection areas. |
| FR-4 | 1–24 circuit layers. | Layer order, laminate, copper distribution, hole structures and thermal features defined by the design. |
| Flexible | 1–6 circuit layers. | Dielectric system, protective layers, bend regions, local reinforcement and finished dimensions. |
| Ceramic | 1–4 circuit layers. | Exact ceramic, metallization construction and drawing requirements; do not treat different ceramic processes as interchangeable. |
Layer counts refer to the conductive circuit construction, not the number of material layers or the metal base. The complete structure determines the applicable process combination.
Fabrication Features and Specification References
Swipe horizontally to view all fabrication requirements.
| Manufacturing Item | Published Reference / Option | Construction-Specific Definition |
|---|---|---|
| Finished thickness |
General reference: 0.4–3.2 mm. Typical tolerance: ±10%. | Specify the finished-board requirement and identify metal-base, dielectric or local thicknesses separately. |
| Circuit copper |
1–10 oz/ft² reference. Common selections: 1, 2 and 3 oz. | Define copper by layer. Confirm the finished-copper basis and applicable construction rather than applying the maximum to all boards. |
| Trace / space |
Standard reference: 4 / 4 mil. Selected advanced builds: 3 / 3 mil. | Review the rule with substrate, copper thickness and feature geometry. It is not a universal metal-base clearance rule. |
| Drilling references |
Mechanical: 0.20 mm. Laser: 0.10 mm, where the construction supports it. | Identify tool or finished-hole dimensions, hole type and layer span. Define isolation from a metal base where required. |
| Board size | Up to 500 × 600 mm reference. | Provide the finished profile, delivery form and substrate. Special long, thin or flexible formats require their own dimensional definition. |
| Thermal dielectric | Specified material grade, thickness and properties. | State dielectric conductivity, electrical insulation and relevant acceptance requirements on a defined material basis. |
| Surface finish | HASL, lead-free HASL, ENIG, OSP, immersion silver and immersion tin options. | Select the finish for the actual substrate and pad requirements. Identify any special local finish separately. |
| Mask and legend | White and other specified mask colors; drawing-defined legend requirements. | Identify coverage, openings, markings and any controlled optical or aging requirements. |
| Bare-board verification | Electrical testing and specified fabrication inspection. | Define acceptance criteria, critical dimensions and any additional insulation tests or requested records. |
Published feature references are not independent maxima to combine. The quotation and released drawing identify the applicable substrate, geometry and acceptance requirements. Assembly and populated-board tests are outside this bare-board table.
Keep Circuit Copper Separate from the Base
Circuit copper weight does not describe aluminum or copper-base thickness. Use the PCB copper thickness reference to define the conductor requirement on the correct basis.
Submit a Complete Fabrication Package
Include the board files, construction section, outline and material requirements. Follow the manufacturing file requirements and identify one matching design revision.
Circuit Copper, Insulation & Metal-Base Definition
Define the Thermal and Electrical Stackup
Specify how the circuit, insulation and base materials work together. A clear construction drawing defines the required thermal connection and electrical isolation rather than relying on an aluminum or copper label alone.
A / Insulated Metal-Base Example
Insulated Metal-Base Construction
In an insulated aluminum PCB or copper-base construction, the dielectric separates the circuit from the base. Define its thickness, thermal properties and electrical acceptance requirements together with the metal and circuit copper.
B / Specified Local Direct Thermal Connection
Drawing-Defined Direct Thermal Region
For a copper-core PCB requiring a local direct thermal connection, identify the exact region and its relationship to the package thermal pad. Confirm electrical compatibility, isolation and geometry in the construction drawing.
- Copper conductor / specified copper region
- Insulating dielectric
- Metal base
Compare Dielectric Systems, Not Just Base Metals
A higher material conductivity number alone does not establish the temperature of an installed LED. For material selection context, review the aluminum PCB material guide and the required dielectric construction.
Keep the Complete Heat Path in View
The package, board structure, mounting interface and cooling system all form part of the application's thermal path. Bare-board fabrication delivers the specified construction; product temperature and lifetime require application-level evaluation.
Pads, Protective Layers & Mechanical Features
LED PCB Fabrication DFM
PCBELEC reviews the supplied LED board design against the selected substrate and fabrication requirements. Identify the features that control electrical isolation, pad access, mounting and the finished board condition.
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LED Pads & Thermal Regions
Define electrical pads and thermal-pad features against the customer design. Identify exposed areas and any direct base connection separately from surrounding insulated circuit features.
Define for Review Pad geometry, thermal-region boundaries, copper connections and applicable isolation.
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Copper, Power Paths & Clearances
Specify conductor copper and critical widths or gaps. Review the copper thickness definition with the substrate and finished geometry rather than treating the base metal as circuit copper.
Define for Review Copper by layer, critical neck-downs, power connections and electrical clearances.
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White Solder Mask & Optical Areas
Identify the required mask color or material specification, pad openings and critical covered regions. Include customer-controlled reflectance, appearance or aging requirements with their evaluation conditions.
Define for Review Mask coverage, registration, exposed areas and any specified optical acceptance basis.
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Surface Finish & Markings
State the finish for exposed pads and conductors. Keep legend and identification outside defined contact or optical areas, and identify polarity or other required markings in the artwork.
Define for Review Finish, local requirements, marking location and critical keepout regions.
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Outline, Holes & Mounting Interface
Dimension the finished profile, holes, slots and any specified recessed features. Identify isolation from the metal base and the edge, burr or flatness criteria relevant to installation.
Define for Review Datums, tolerances, hole type, metal clearances and mounting contact requirements.
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Panelization & Depanelization
State single-board or panel delivery and the required separation method. Review V-scoring, routed tabs and rails against the selected substrate; do not apply one method to every construction.
Define for Review Panel layout, board count, separation features and required finished edge condition.
Flexible LED Boards Need Their Own Construction Notes
For a flexible PCB used in LED applications, define bend regions, protective layers and stiffeners. Metal-base routing and separation assumptions do not automatically apply to flex.
Keep the Release Consistent
Match the artwork, outline, drill data and construction drawing to one revision. Follow the PCB manufacturing file requirements and identify unresolved specifications before release.
Drawing-Based Acceptance & Requested Records
LED Bare PCB Inspection & Verification
Define the inspection scope around the released board construction and acceptance requirements. Keep visual and dimensional inspection, circuit electrical testing and specified insulation verification clearly identified.
01 / Physical Board Features
Visual & Dimensional Inspection
Identify the physical features that must match the released drawing, including the board profile, pad openings, mounting features and required surface or edge condition.
- Finished dimensions, thickness and critical tolerances.
- Hole and slot position, profile features and mounting references.
- Mask coverage, markings, exposed areas and specified finish or edge criteria.
02 / Circuit Connectivity
Bare-Board Electrical Testing
Establish the circuit acceptance basis from the released design data. Identify intended connections, isolated nets and any defined relationship between the circuit and metal base.
- Continuity and isolation requirements for the specified circuit.
- Intended thermal-region or base connections shown in the construction.
- Customer-supplied netlist or other agreed electrical reference where required.
03 / Requirement-Specific Verification
Specified Insulation & Additional Tests
Request additional verification with a defined method and acceptance basis. Identify the exact regions to be checked, rather than applying a generic test statement to every construction.
- Test points and required isolation between circuit, thermal regions and base.
- Specified voltage, duration and acceptance limits where applicable.
- Agreed test scope, sampling or coverage, and reporting requirements.
Bare-Board Acceptance Is Separate from Product Validation
This section covers the fabricated board, not populated LED light-up, optical output or complete luminaire performance. List bare-board acceptance requirements alongside the manufacturing file package so the quotation and production release use the same specification.
Custom Profiles & Revision-Controlled Orders
LED PCB Formats & Production Orders
Define the board shape, delivery format and order quantity with the construction. Keep the released specification consistent as the project moves from initial prototypes to repeat production orders.
Linear & Strip Profiles
Provide the finished length, width and mounting references for linear LED boards. Identify repeated pad positions, critical hole spacing and single-board or panel delivery.
Round & Custom Profiles
Define the outline from the released drawing, including openings, mounting features and relevant datums. State the tolerances that control fit in the intended lighting assembly.
Arrays & Delivery Panels
Specify the unit count, panel dimensions, rails and required separation features. Distinguish finished-board quantity from panel quantity in the quotation and order.
From Prototype to Repeat Production
Use a clear release baseline for each order. Identify changes between stages instead of assuming the prototype and production packages are identical.
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01 / Initial Build
Prototype Definition
Submit the design revision, construction, quantity and required delivery date. Mark the fit, electrical or thermal features that the prototype is intended to evaluate.
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02 / Updated Release
Pilot or Revised Build
Incorporate approved changes into one updated file package. Confirm the material, board or panel format, acceptance requirements and any requested records.
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03 / Production Order
Repeat the Approved Specification
Identify the approved revision and purchase requirements. Review any proposed material, construction, tooling or acceptance changes before releasing the next order.
Bare-Board Files & Manufacturing Requirements
Request an LED PCB Fabrication Quote
Send your design files, construction requirements and order details for review. If the material or stackup is not fixed, identify the open requirements in your inquiry.
What to Include
- Gerber or agreed fabrication data, drill files and the finished board outline.
- Construction drawing, material, thickness and circuit copper requirements.
- Thermal regions, insulation, finish and critical mechanical requirements.
- Finished-board quantity, panel delivery requirements and requested delivery date.
- Required inspection records or additional verification identified with the specification.
Review the PCB manufacturing file requirements before sending the release package.
Prefer to Email Directly?
sales@pcbelec.comPrepare Your RFQ Email
Organize the main requirements below, review the generated text and open an email draft when ready.
If no email application opens, select and copy the text into your preferred email service. Remember to attach the board files.
Materials, Files & Bare-Board Ordering
LED PCB Manufacturing FAQ
Practical answers for selecting a construction, defining fabrication requirements and preparing an LED bare-board inquiry.
What types of LED bare PCBs can I request?
PCBELEC accepts inquiries for aluminum-based, copper-based, FR-4 and flexible LED bare boards, along with specified ceramic constructions for review. Provide the material and construction requirements so the quotation addresses the actual build.
How should I choose between aluminum, copper-base and FR-4?
Define the circuit layout, insulation, thermal path and mounting requirements first. Compare the complete construction rather than ranking substrates by base-metal conductivity alone. See the LED PCB construction options and identify any material or stackup decisions that remain open.
Does dielectric conductivity describe the whole board's thermal performance?
No. Dielectric conductivity is a material property, not a complete board or installed-product performance rating. Specify the material grade, thickness and relevant test basis. The thermal and electrical stackup should also define the circuit, base and required connection or insulation regions.
What files are needed for an LED PCB fabrication quote?
Send the fabrication artwork, drill data, finished outline and construction requirements with one matching revision. Include quantity, material, thickness, copper, finish and any critical insulation or mechanical requirements. Review the manufacturing file requirements for the release package.
Can I specify white solder mask and optical-area requirements?
Include the required mask color or material specification, coverage and pad openings. If reflectance, appearance or aging performance is controlled, provide the evaluation conditions and acceptance criteria for review. White mask alone should not be treated as a defined optical or non-yellowing guarantee.
How do I request insulation testing or inspection records?
Identify the regions to be tested, the required method and acceptance limits. For specified insulation verification, include applicable voltage, duration and coverage requirements. Request any reports or material records in the quotation package so their scope can be agreed before production release.
Can the order move from prototypes to production?
Submit the quantity for each stage and identify the approved design revision. Carry forward the agreed construction, delivery format and acceptance requirements, and clearly mark changes before the next order. See the prototype-to-production ordering section for the release information.
What determines the quoted price and delivery?
Provide the construction, board dimensions, quantity, copper and finish requirements, delivery format and any additional verification or records. Include the requested date and destination. Price and delivery are confirmed for the reviewed specification in the quotation.
Where should I request LED PCB assembly or populated boards?
This PCBELEC page focuses on bare-board fabrication. For component assembly and populated LED boards, visit LED PCB Assembly at JHYPCB. Submit assembly-specific files and requirements through that service.
Ready to review a specific board construction? Prepare the fabrication files and order requirements.
Prepare an LED PCB RFQRelated Manufacturing & Specification References
LED PCB Resources
Explore the related board services, clarify construction requirements and prepare the files for your bare-board fabrication inquiry.