Bare PCB File Preparation & Submission
PCB Manufacturing File Requirements
Prepare your Gerber, drill and routing data with the drawings, stackup and specifications needed for a bare PCB quotation. Use the checklist below to organize the package, identify open requirements and submit your files to PCBELEC for review.
Prefer email? Send your files and requirements to sales@pcbelec.com
- Production Data Layers, Holes & Profile Identify the circuit layers, drill data and finished board outline.
- Manufacturing Definition Stackup & Specifications State material, thickness, copper, finish and applicable special requirements.
- Submission Context Revision, Quantity & Schedule Keep the design revision clear and identify any open specification items.
Bare PCB Quotation & Fabrication Preparation
PCB Fabrication File Checklist
For a Gerber-based bare PCB request, prepare the layer data, applicable drill and routing information, a clear board profile and manufacturing specifications. Include supporting drawings and stackup details where the design requires them.
Submit the Available Files and Known Requirements
Share the current design revision, required quantity and known board specifications. Identify open items, such as material, stackup or copper requirements, so they can be addressed during engineering review.
Confirm One Consistent Production Definition
Release matching artwork, drawings and specifications with resolved manufacturing requirements. File submission for quotation is not, by itself, authorization to begin production.
What to Include in a Gerber-Based File Package
Swipe horizontally to view the complete checklist.
| File / Information | What It Defines | When to Include It |
|---|---|---|
| Copper layer data | The conductor pattern on each copper layer, with a clear layer identity and order. | Include every conductive layer used in the released board design. |
| Solder mask and legend | Mask openings and printed markings on the specified board faces. | Include the layers used by the design. Explicitly identify intentional mask or legend omissions. |
| Drill data | Hole positions, sizes and tool definitions, with plated and non-plated holes identified. | Include for boards with drilled holes. Define special hole structures in supporting notes. |
| Board profile and routing | Finished board outline, internal cut-outs, slots and applicable routed features. | Provide an unambiguous profile. Define slot and cut-out dimensions, positions and plating where applicable. |
| Stackup information | Layer order, copper requirements, dielectric construction and relevant material information. | Particularly important for multilayer, impedance-controlled, HDI, heavy-copper and structure-sensitive builds. |
| Fabrication drawing / notes | Board dimensions, thickness, tolerances, finish and requirements not fully defined by layer images. | Include drawing-controlled features and special instructions. Simple builds still need clear manufacturing specifications. |
| Electrical reference netlist | An independent reference for the intended electrical connectivity. | Include when available and identify the format for engineering review; it does not replace the fabrication layer data. |
| Order and specification summary | Part number, revision, quantity, material, copper, finish and delivery requirements. | Include with the inquiry and keep it consistent with the drawing and file package. |
This checklist describes information content, not a mandatory number of files. A structured production-data package may contain several items together. Clearly identify the intended production source and any reference-only documents.
Production Data & Supporting Documents
Production Files and Supported Data Formats
Use a clearly identified production data set with the information needed to interpret it. File extensions alone do not establish layer function, design revision or manufacturing requirements.
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Layer Images & Attributes
Gerber Layer Data
Provide Gerber copper, solder-mask and legend layers as applicable, with a clearly identified board profile. Preserve X2 attributes when available to help communicate layer and feature functions.
Include When Available A Gerber Job file can carry additional manufacturing information. Keep its content consistent with the fabrication notes and drawing.
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Holes, Slots & Routed Features
NC Drill / Excellon and Routing Data
Provide drill locations, tool sizes and format information with explicit units. Identify plated and non-plated holes, slots and routing features using a consistent coordinate reference.
Check Before Export Drill and route data should align with the copper and board profile. State finished hole sizes and drawing-controlled tolerances clearly.
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Additional Production-Data Options
ODB++, IPC-2581 and Native CAD Files
If you plan to submit an alternative production format or native design, identify the format, CAD system and version for engineering review. Confirm the usable production data set before manufacturing release.
Avoid Conflicting Sources If multiple formats are supplied, state which is intended for production and which are reference-only. Include standard fabrication outputs where available.
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Requirements Beyond Layer Images
Fabrication Drawings, Stackup and Notes
Include a readable fabrication drawing and stackup where required. Use supporting documents to define dimensions, tolerances, materials, copper, finish and special processes that are not clear from layer data.
Reference Documents PDF drawings and specification notes support the production data. Screenshots or board photographs alone do not define a fabrication package.
Keep Layer Mapping Readable
CAD tools use different naming conventions and extensions. Preserve the original outputs and provide a layer map or README when the layer order or function is not self-explanatory.
Packaging Is Not a Production Format
An archive groups files for transfer; it does not define their manufacturing meaning. Use one clearly identified revision and follow the submission form's actual file-type and size limits.
Requirements Beyond the Layer Images
Manufacturing Specifications to Include
Layer data describes the circuit pattern, but it does not define every manufacturing requirement. Include a clear specification summary with the drawing, stackup and order details so the quotation reflects the intended bare PCB.
Board and Order Specification Checklist
Swipe horizontally to view the full specification checklist.
| Specification Item | Information to Provide | Clarify Where Applicable |
|---|---|---|
| Part number and revision | Project or PCB part number and the design revision being quoted. | Identify any change from a previous order and distinguish production data from reference files. |
| Dimensions and delivery form | Finished board dimensions, profile and single-board or panel delivery requirement. | Include critical tolerances, slots, cut-outs and any customer-controlled panel drawing. |
| Layers and board thickness | Layer count, layer order, finished board thickness and tolerance. | Define local thickness requirements or measurement locations where they differ from the general board. |
| Material and stackup | Required material grade or performance requirements, with the stackup where applicable. | Identify mandatory materials, permitted alternatives and relevant thermal or electrical properties. |
| Copper requirements | Copper specification by layer, with units and a starting or finished copper basis. | State minimum finished copper requirements and hole-wall copper separately where specified. |
| Surface finish | Required finish on the exposed pads and conductors. | Identify local finishes, selective plating and any deposit-thickness requirements. |
| Solder mask and legend | Required colors, applicable board faces and relevant mask or marking notes. | Define intentionally exposed copper, special via treatment and critical marking areas. |
| Testing and acceptance | Applicable acceptance requirements, electrical test needs and requested inspection documentation. | Include the standard and revision, customer-specific criteria, critical measurements and report format. |
| Quantity and delivery | Required quantity, target delivery date and shipping destination. | State whether quantity means individual boards or panels, and identify any staged deliveries. |
Provide the requirements relevant to your design. Special structures may need additional details beyond this general checklist; define them with the corresponding drawings and notes.
Keep the Inquiry and Drawing Consistent
Use the same revision and specification values in the inquiry form, fabrication notes and stackup. Flag differences explicitly so they can be resolved before manufacturing release.
Specify Copper on the Correct Basis
A nominal copper-weight conversion does not automatically establish a minimum finished thickness. Identify the layer and intended acceptance basis.
Copper Thickness ReferenceAdd These Details Where They Apply
Additional Files for Special PCB Builds
Special constructions need information beyond the basic layer and drill files. Include the relevant details below only where they apply to your design, using drawings that match the submitted board revision.
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Controlled Impedance
Identify target impedance and tolerance, single-ended or differential structures, relevant layers and reference planes. State whether the stackup and conductor geometry are fixed or may be adjusted through engineering review.
Supporting Information Impedance table, stackup and identified nets or structures; include coupon or test-report requirements where specified.
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Heavy Copper
Define copper by layer and distinguish starting foil from required finished conductor copper. Identify hole-wall copper, critical power-path dimensions and any features that require approval before modification.
Supporting Information Layer-specific copper table, released stackup and relevant dimensional or inspection notes.
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Gold Fingers & Edge Contacts
Mark contact geometry and selective plating boundaries. Specify gold and nickel requirements separately, together with finished edge thickness, bevel geometry and the mating connector reference.
Supporting Information Contact drawing, plating notes, bevel section and connector interface dimensions.
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Flexible & Rigid-Flex Circuits
Identify flexible and rigid regions, Coverlay openings, stiffeners and local thickness requirements. Mark bend regions and provide relevant installation or repeated-flex requirements as design context.
Supporting Information Construction drawing, layer transitions, Coverlay and reinforcement data, bend notes and critical tolerances.
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Copper Core & Metal-Base PCBs
Define the circuit copper, dielectric and metal base as separate requirements. Identify any direct thermal connection areas, isolation requirements and local mechanical features explicitly.
Supporting Information Construction cross-section, material requirements, base thickness and finished-board dimensions.
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HDI & Special Via Structures
Identify each via type and its start and end layers. Define blind, buried or microvia structures, any stacked or staggered arrangement, and required filling, capping or other via treatment.
Supporting Information Drill-pair map, construction sections, via-treatment notes and applicable verification requirements.
Related fabrication guidance for your board construction:
Revision Control & Final Submission Check
Organize and Verify Your File Package
Submit one clearly identified design revision with matching artwork, drill data, drawings and specifications. Use a short README to explain layer mapping, production sources and any open requirements.
Example / Adapt to Your CAD Outputs
A Readable Fabrication Package
Group production files and supporting documents so their purpose and revision are easy to identify.
ProjectName_RevC_Fabrication/
|
+-- README_RevC.txt
|
+-- Gerber/
| +-- Copper layer files
| +-- Solder mask files
| +-- Legend files, if used
| +-- Board profile
| +-- Gerber Job file, if available
|
+-- Drill_Route/
| +-- Plated-hole data
| +-- Non-plated-hole data
| +-- Slots and routing, if applicable
|
+-- Drawings/
+-- Fabrication drawing
+-- Stackup, where applicableThis is an organizational example, not a mandatory folder structure. Preserve meaningful CAD-generated names and extensions; provide a layer map when needed.
Check These Items Before Sending
One Design Revision
Remove superseded production files from the package, or clearly mark them as reference-only. Match the drawing and stackup to the intended board revision.
Readable Layer Mapping
Identify copper order and the function of mask, legend and mechanical outputs. Explain non-obvious names in the README rather than relying on extensions alone.
Aligned Drill and Profile Data
Check the exported files together in a suitable viewer. Confirm board dimensions, units, alignment, hole positions and the intended plated or non-plated features.
Consistent Specifications
Compare material, board thickness, copper and finish across the inquiry, drawing and stackup. Identify any discrepancy for resolution before release.
Special Features Defined
Include applicable impedance, via treatment, edge plating, gold-finger, flex, metal-base or panel-delivery instructions with the matching drawings.
Package Opens Correctly
Verify that the archive extracts and the documents are readable. Follow the submission channel's actual file-type, size and file-count limits.
Bare PCB Manufacturing Inquiry
Submit PCB Files for Review and Quotation
Share your fabrication package, required quantity and known board specifications with PCBELEC. Identify any open requirements so the inquiry can be reviewed on a clear manufacturing basis.
Make Your Submission Easy to Review
- Identify the Design Include the part number, revision and previous inquiry or order reference where applicable.
- Include the Manufacturing Basis Send the available artwork, drill data, drawing, stackup and specification summary.
- State Quantity and Schedule Identify boards or panels, the required quantity and target delivery date.
- Mark Open Items Explain any specifications requiring review instead of leaving conflicting values in the package.
Share Your Files and Project Details
Complete the form below and upload the available fabrication files. If the package is not ready, describe the project and identify the information still being finalized.
Before You Send Your Board Files
PCB Manufacturing Files FAQ
Answers to common questions about fabrication data, missing specifications, native design files and manufacturing release.
If a requirement is still open, identify it with the inquiry. Keep the intended design revision clear across the package.
Return to the File ChecklistAre Gerber files alone enough for a bare PCB quotation?
Gerber layer images alone may not provide all the information needed for a reliable quotation. Include applicable drill and routing data, a clear board profile, quantity and manufacturing specifications.
Material, finished thickness, copper, finish and special requirements should be stated in the inquiry, drawing, stackup or supporting notes.
What is the difference between layer data and NC drill data?
Layer data describes features such as copper, solder-mask openings and legend. NC drill data describes hole locations and tool sizes.
In a Gerber-and-Excellon package, provide the relevant outputs together. Identify plated and non-plated holes and define slots or routing explicitly.
Can I submit native PCB design files instead of Gerber files?
Identify the native format, CAD system and version so engineering can review the available data. Include standard fabrication outputs where available and confirm the intended production source before release.
A native file extension alone does not establish compatibility or define the complete manufacturing requirements.
Do I need a detailed stackup for a simple two-layer PCB?
A simple two-layer board may not need the same detailed stackup documentation as a complex multilayer construction. It still needs clear material, board thickness and copper requirements for both layers.
Include a stackup or construction drawing when impedance, special materials, local thickness or other structure-dependent requirements need to be controlled.
Do I need a BOM or pick-and-place file for bare PCBs?
Not normally. A BOM and component placement file are assembly-related data rather than the core fabrication package for an unpopulated PCB.
For a bare-board inquiry, focus on the circuit data, holes, profile, construction and manufacturing specifications. Include paste data when stencil-related deliverables are part of the request.
Can I request a quote before every specification is finalized?
Yes. Send the available files, required quantity and known specifications, and identify the items that need review. State whether the data is preliminary or a released revision.
The quotation basis and production definition need to reflect the confirmed requirements. Do not leave unresolved values hidden in conflicting documents.
How should I submit a revised fabrication package?
Reference the earlier inquiry or order, state the new revision and summarize the changes. Identify which previous package is superseded and provide a consistent updated file set.
For an order already in progress, obtain confirmation that the change has been reviewed. A new upload does not automatically replace released manufacturing data.
Does uploading files authorize PCB production?
No. Submitting files through the quotation form is a request for review and quotation, not production authorization by itself.
Manufacturing proceeds on the agreed order and confirmed production data. Identify reference-only or preliminary files clearly in the submission.