PCB Fabrication Process

We have now covered initial PCB production processes – substrate preparation, imaging, plating, etching to form circuitry. The board is now a semi-finished product. This section explains solder mask application to shield copper traces, silkscreen printing for informational markings and labels, and surface metal treatments to protect pads from oxidation while promoting soldering. With these enhancements, boards are fully ready for electronics assembly.

We have covered initial PCB production steps – milling, foil lamination, drilling. Now we detail processes to transform base material into functional printed circuit board. First, copper electroplating deposits into drilled holes and grows copper thickness. Photolithography uses UV light to transfer layout pattern onto copper layer. Exposed copper gets etched away, leaving only desired conductive traces. Finally, automated optical inspection compares board to original design to validate quality.

In our PCB manufacturing process deep dive, we explored lamination, exposure, and development steps that transfer circuit layouts onto boards. Up next, we tackle graphical electrodeposition and AOI.

Dive into the world of PCB manufacturing with our comprehensive guide, focusing on three crucial stages: Manufacturing Instruction (MI), Material Cutting, and Drilling. Join us on a journey through precision and innovation at JHYPCB, where every step in the process plays a vital role in creating high-quality printed circuit boards.