PCB Manufacturing Process

PCB Drilling Process

A Complete Guide on PCB Drilling Process

This definitive guide covers all PCB drilling process fundamentals – understanding different hole types like plated through holes (PTHs), preparation steps for quality drilling, mechanical/laser drilling methods, addressing common quality issues, to inspection and improvements. Equip PCB designers, engineers and manufacturers with all the essential knowledge spanning drilling drawings, stack-up, parameters, tool selection to quality control procedures for optimized fabrication.

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Solder Mask Line

Navigating The PCB Manufacturing Process Part 4: Solder Mask, Silkscreen, Surface Finish

We have now covered initial PCB production processes – substrate preparation, imaging, plating, etching to form circuitry. The board is now a semi-finished product. This section explains solder mask application to shield copper traces, silkscreen printing for informational markings and labels, and surface metal treatments to protect pads from oxidation while promoting soldering. With these enhancements, boards are fully ready for electronics assembly.

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Pattern Plating Line

Navigating The PCB Manufacturing Process Part 3: Pattern And AOI

We have covered initial PCB production steps – milling, foil lamination, drilling. Now we detail processes to transform base material into functional printed circuit board. First, copper electroplating deposits into drilled holes and grows copper thickness. Photolithography uses UV light to transfer layout pattern onto copper layer. Exposed copper gets etched away, leaving only desired conductive traces. Finally, automated optical inspection compares board to original design to validate quality.

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