Understanding the key differences between PTH and via is essential for optimizing PCB design and manufacturing. This article defines PTH and via, compares dimensions, functions, locations and finishing requirements. Typical applications and design considerations are also discussed.
What is the Difference Between PTH and Via in PCBs? Read More »
With the exponential rise of high-frequency applications, backdrilled vias are increasingly critical for minimizing via stub impedance on PCBs. As this blog explains, backdrilling eliminates non-functional lower via portions to enable pristine signal transmission up to microwave frequencies…
What is Backdrilling of Vias and Why it Matters for PCBs Read More »
Plated half-holes, also called castellated holes, provide a space-efficient way to interconnect separate PCB modules by soldering. Unlike bottom pads, their edge positioning simplifies mounting and enhances reliability. This article explains everything about plated half-hole structures, design guidelines, manufacture, benefits and use cases.
Understanding Plated Half-Holes (Castellated Holes) in PCB Design Read More »
Via-in-pad refers to drilling vias on pads, commonly used for high density SMD and BGA pads. This article covers in detail the design guidelines, manufacturing process of via-in-pad, and makes comparison of with and without via-in-pad process.
Identifying and Processing Via-In-Pad in PCB Design Read More »
Via-in-pad technology for PCBs places vias directly within surface mount pads, conserving space by merging interconnect structures. Learn benefits and reliability factors in applying this innovation.
An Introduction to Via-in-Pad for Printed Circuit Boards Read More »
Filled and capped vias are advanced PCB design techniques that measurably enhance connection reliability. Learn when and why to leverage precision via filling and durable capping to prevent moisture ingress, fractures, and short circuits.
Leveraging Filled and Capped Vias for Enhanced PCB Reliability Read More »
What are tented vias and why should PCB designers use them? Read our full guide covering how tented vias work, their benefits, ideal applications, and how to construct boards with quality via tenting.
What are Tented Vias? A Guide to This Important PCB Feature Read More »
Blind vias and buried vias enable improved signal routing, component density, performance, and simplified PCB stackups essential for complex, high-speed designs. This article explains what blind and buried vias are and key considerations for implementation.
Blind Vias, Buried Vias in PCBs – A Complete Guide Read More »
Plated through holes (PTHs) are vital in printed circuit boards for enabling reliable connectivity between layers. This article explores PTHs in depth—from their key benefits like durable interlayer connections and flexible component placement, to critical design considerations around hole size, spacing, depth. We also contrast PTHs to cheaper non-plated holes, and overview popular alternatives like blind and buried vias and their ideal use cases. For PCB designers and manufacturers, our insights help inform effective PTH integration tailored to your product requirements. Reach out to explore our professional PCB fabrication utilizing PTHs.
Understanding Plated Through Holes (PTH) for Printed Circuit Boards Read More »
Vias enable complex functionality in printed circuit boards by facilitating vertical transitions between layers. This article provides an overview of via roles, types, reliability factors, advanced structures, and the ongoing innovation driving PCB performance.
As printed circuit boards are designed to pack more components into increasingly compact spaces, microvias play a crucial role in enabling further miniaturization. We explore the fundamentals of microvia technology and fabrication processes along with applications across consumer electronics, automotive, aerospace and medical industries.
The Essentials of Microvias – Enabling Miniaturization in PCBs Read More »
