PCB FABRICATION CAPABILITIES
HDI PCB Manufacturing Capabilities
Explore our HDI PCB fabrication capabilities, including build-up structures, fine-line routing, laser microvias, and material options. Review the specifications below, then submit your fabrication files and proposed stackup for a project-specific manufacturing assessment.
Final capability and lead time depend on your stackup, via configuration, materials, and order quantity.
Construction, Routing & Review
HDI PCB Capability Overview
Review the listed build-up configurations, routing references and microvia requirements. For higher-order or Any-Layer projects, submit the complete construction for a project-specific manufacturing assessment.
Build-Up Structures
1+N+1 to 3+N+3
Compare listed configurations and stacked or staggered microvia options by production stage.
View the Structure MatrixConstruction & Routing
Stackup & Fine-Line Requirements
Evaluate layer count, board thickness, copper and trace spacing as a complete construction rather than independent minimum values.
Microvias
Via Geometry & Interconnections
Define laser-hole dimensions, layer spans, capture pads and filling requirements with the proposed dielectric construction.
Advanced Project Review
Higher-Order & Any-Layer HDI
Submit 4th- to 7th-order HDI and Any-Layer requirements for construction and production-stage confirmation.
Review Advanced StructuresProject-specific assessment: Capability limits depend on the stackup, material system, copper thickness, via geometry and intended quantity. Industry reference values elsewhere on this page are benchmarks, not one combined PCBELEC process specification.
Build-Up & Production Availability
Supported HDI Structures
Compare the listed configurations by via structure and production stage. Higher-order and Any-Layer requirements are addressed separately below through project-specific manufacturing review.
Swipe horizontally to view the complete structure matrix.
| HDI Structure | Via Configuration | Minimum Layer Count | Prototype | Small / Medium Batch | Volume Production |
|---|---|---|---|---|---|
| 1+N+1 | Blind vias | 4 layers | Available | Available | Available |
| 2+N+2 | Blind / buried vias Staggered microvias | 6 layers | Available | Available | Available |
| 2+N+2 | Blind / buried vias Stacked microvias | 6 layers | Available | Available | Available |
| 3+N+3 | Blind / buried vias Staggered microvias | 8 layers | Available | Available | Available |
| 3+N+3 | Blind / buried vias Stacked microvias | 8 layers | Available | Available | Available |
Availability: “Available” identifies a listed production stage; it is not approval of every material, feature or tolerance combination within that category.
Layer-count definition: Minimum layer counts are not maximum board-layer capabilities. Submit the complete stackup and via definitions to confirm the proposed construction.
Advanced HDI & Any-Layer Project Review
Beyond the matrix above, PCBELEC reviews higher-order HDI requirements, including 4th- to 7th-order builds and Any-Layer interconnect projects. Provide the complete stackup, via map, materials and intended quantity to confirm the construction and production stage.
Higher-Order HDI
Identify the intended build-up arrangement and layer connections explicitly. An order designation alone does not define a symmetric stackup, total layer count or lamination sequence.
Any-Layer Interconnections
Supply the required layer-to-layer connections and microvia arrangement. Confirm the material system, via geometry, copper filling and applicable verification requirements for the proposed design.
Representative constructions in our supplied product information
Product examples do not establish a universal process window or availability at every production volume. Higher-order designations are not automatically equivalent to a specific symmetric build-up notation or fixed number of lamination cycles.
HDI PCB Capability Reference
Compare standard and advanced industry reference values for fine-line routing, laser microvias, capture pads, and build-up dielectrics. Use these benchmarks to define your project requirements, then confirm the complete specification set with PCBELEC.
Scroll horizontally to view all capability values and notes.
| Parameter | Standard Reference | Advanced Reference | Conditions / Notes |
|---|---|---|---|
| Fine-Line Routing | |||
| Minimum Outer-Layer Trace Width | 88.9 µm 3.5 mil | 76.2 µm 3.0 mil | TTM reference. Confirm applicability for the specified outer-layer copper and plating process. |
| Minimum Outer-Layer Spacing | 88.9 µm 3.5 mil | 88.9 µm 3.5 mil | TTM advanced reference; its development tier lists 76.2 µm / 3.0 mil. |
| Minimum Inner-Layer Trace Width / Spacing | 76.2 / 76.2 µm 3.0 / 3.0 mil | 63.5 / 63.5 µm 2.5 / 2.5 mil | TTM reference; its development tier lists 50.8 / 50.8 µm, or 2.0 / 2.0 mil. |
| Mechanical Drilling | |||
| Minimum Through-Hole Drill Size | 254 µm 10 mil | 203.2 µm 8 mil | TTM reference; its development tier lists 152.4 µm / 6 mil. Drill size is not finished plated hole diameter. |
| Minimum Through-Hole Pad Diameter | Drill + 254 µm Drill + 10 mil | Drill + 228.6 µm Drill + 9 mil | TTM reference. The increment applies to total pad diameter, not single-sided annular ring. |
| Minimum Buried-Via Drill Size | 203.2 µm 8 mil | 152.4 µm 6 mil | TTM reference. Confirm buried-via depth, plating requirements, and subassembly construction. |
| Laser Microvias & Copper Filling | |||
| Minimum Laser Microvia Diameter | 101.6 µm 4 mil | 63.5 µm 2.5 mil | AdvancedPCB reference. Evaluate diameter together with dielectric thickness and via depth. |
| Minimum Copper-Filled Microvia Diameter | 101.6 µm 4 mil | 63.5 µm 2.5 mil | AdvancedPCB reference. Copper filling requirements must be defined separately from resin plugging. |
| Laser Microvia Aspect Ratio | 0.75:1 Depth : diameter | 1:1 Depth : diameter | AdvancedPCB reference. The ratio must be assessed with the actual via geometry and material system. |
| Microvia Capture Pad Diameter | Drill + 203.2 µm Drill + 8 mil | Drill + 152.4 µm Drill + 6 mil | AdvancedPCB reference. Values describe total pad diameter. |
| Microvia Landing Pad Diameter | Drill + 203.2 µm Drill + 8 mil | Drill + 152.4 µm Drill + 6 mil | AdvancedPCB reference. Confirm registration allowances for the proposed stackup. |
| Build-up Dielectrics & Base Copper | |||
| Build-up Dielectric Thickness | 63.5–101.6 µm 2.5–4 mil | 50.8–101.6 µm 2–4 mil | TTM reference. Confirm dielectric thickness with microvia diameter and impedance requirements. |
| Base Copper Thickness | 5.08–7.11 µm 0.2–0.28 mil | 7.11–8.89 µm 0.28–0.35 mil | TTM reference. Base copper thickness is not finished copper thickness after plating. |
PCBELEC Quality & Verification
- 100% Impedance Testing Specify target values, tolerances, and applicable layers or nets.
- Microsection Reports Included with every order.
- IPC Class 3 Supported Specify the applicable standard, revision, and acceptance requirements.
HDI Manufacturing Review Requirements
Provide your fabrication files, proposed stackup, and via requirements so your HDI project can be reviewed against the listed manufacturing capabilities. Clear technical requirements help define the scope of your quotation and identify details that need confirmation.
Fabrication Files & Stackup
- PCB fabrication files and fabrication drawing
- Proposed layer stackup and finished board thickness
- Material requirements and copper thickness by layer
- Board outline, dimensions, and panel requirements, if applicable
Via & Routing Requirements
- Via definitions showing start and end layers
- Stacked or staggered microvia configuration
- Hole dimensions, identified as drill or finished sizes
- Via-in-pad, filling, capping, and impedance requirements, if applicable
Order & Acceptance Requirements
- Order quantity and prototype or production stage
- Requested delivery date
- Surface finish and solder mask requirements
- Applicable acceptance criteria and required documentation
HDI PCB Quality & Verification
Our HDI PCB quality verification includes microsection reports for every order, 100% impedance testing, and support for IPC Class 3 requirements. Specify your acceptance criteria and impedance requirements with your fabrication files so they can be incorporated into the order specifications.
Microsection Reports for Every Order
A microsection report is provided with every HDI PCB order as part of the quality documentation. Include any customer-specific reporting or acceptance requirements with your inquiry.
100% Impedance Testing
We provide 100% impedance testing. Include your target impedance values, tolerances, and applicable layers or nets in the fabrication documentation so the test requirements are clearly defined.
IPC Class 3 Support
We support HDI PCB fabrication to IPC Class 3 requirements. Specify the applicable IPC standard, revision, and any additional customer requirements so the acceptance criteria are clearly defined before production.
Structures, Specifications & Verification
HDI PCB Capability FAQs
Find answers about listed structures, advanced project review, parameter references and order requirements.
Which HDI build-up structures are listed in your capabilities?
The structure matrix lists 1+N+1, 2+N+2 and 3+N+3, with stacked and staggered microvia configurations shown separately for 2+N+2 and 3+N+3. Higher-order and Any-Layer requirements are addressed through the advanced project review described below the matrix.
Can you review 4th- to 7th-order and Any-Layer HDI projects?
Yes. Submit the complete stackup, via map, materials, feature requirements and intended quantity for advanced HDI review. The applicable construction and production stage must be confirmed for the project rather than inferred from a product name alone.
Does prototype availability automatically mean volume production is supported?
No. Use the listed production-stage matrix for the specified configuration. For higher-order, Any-Layer or other combinations outside that matrix, confirm the intended quantity, process conditions and acceptance requirements separately.
Can all listed minimum specifications be combined in one HDI design?
No. The standard, advanced and development values in the capability reference table come from different published process tiers and do not define one combined manufacturing specification. Final acceptance depends on the complete stackup, materials, copper, via geometry and order requirements.
What files are required for an HDI manufacturing review?
Provide fabrication and drill data, the proposed stackup, material and copper requirements, and a via map identifying start and end layers. Include filling, impedance, tolerances, quantity and delivery requirements. See our manufacturing file requirements for preparation guidance.
Do you provide microsection reports and impedance testing?
Yes. Microsection reports are included with every order, and we provide 100% impedance testing. Specify impedance targets, tolerances and the applicable layers or nets in the fabrication documentation, together with any customer-specific reporting requirements.
Can you manufacture HDI PCBs to IPC Class 3 requirements?
Yes. We support HDI fabrication to IPC Class 3 requirements. Identify the applicable IPC standard, revision and any additional acceptance requirements when submitting the project so the order criteria can be defined before production.
Continue Your Manufacturing Review
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PCB Prototype Services
Review prototype service options for engineering samples, design revisions and the next development stage.
Explore PCB PrototypingOverall Capabilities
PCB Manufacturing Capabilities
Compare other board types and related fabrication specifications through the main capability overview.
View Overall CapabilitiesRequest a Quote for Your HDI PCB Project
Submit your fabrication files, proposed stackup and via definitions with the quantity and delivery requirements. Highlight higher-order structures, Any-Layer connections, impedance targets and IPC Class 3 requirements where applicable.
Final manufacturing acceptance, pricing and lead time depend on the confirmed construction, materials, verification scope and order requirements.